EC-326

DESCRIPTION:

EC-326 is a Bisphenol A based acetate/proprionate epoxy curative. This low melting curative is ideal for chain extension. It is soluble in most epoxy monomers. The curative provides thermosets with low moisture uptake relative to a phenolic curative. Depending on the epoxy to curative ratios, the properties range from tough thermosets to thermoplastics. EC-326, unlike phenolic curatives, does not interfere with free-radical cure in hybrid adhesive systems.

HIGHLIGHTS:

• Hydrolytically resistant
• Low melting point
• Thermal stability
• Hydrophobic
• Toughener
• Does not impede free-radical cure

RECOMMENDED USE:

EC-326 is recommended for use as an epoxy curative to improve toughness, hydrophobicity, and hydrolytic stability. A one-to-one equivalent ratio of EC-326 to a difunctional epoxy will (depending on the catalyst used) cure to a thermoplastic resin. To form a thermoset, a twenty equivalent percent excess, or more, of epoxy is recommended. Standard epoxy catalysts such as amines, imidizoles, and Lewis acids work well to cure the EC-326 with epoxy resins.

cure in hybrid adhesive systems.

Refer to the EC-326 Technical Data Sheet for additional information or you may contact Customer Service at 858-348-1122.