EC-861 

DESCRIPTION:

EC-861 is a phenyl acetate epoxy curative.  When cured with an epoxy, the resulting thermoset displays a high level of toughness and flexibility.  The monomer is hydrophobic by nature and results in more hydrophobic thermosets.  The low viscosity makes it an ideal monomer to formulate in epoxy resin systems.  The phenyl end group, unlike phenolics, does not interfere with free-radical cure in hybrid adhesive systems.

HIGHLIGHTS:

• Low modulus
• Toughener
• Hydrolytically resistant thermosets
• Hydrophobic
• Thermal stability
• Does not impede free-radical cure

RECOMMENDED USE:

EC-861 is recommended for use as an epoxy curative for systems requiring a high level of toughness, hydrophobicity, and low modulus.  EC-861 curative should be used in conjunction with multifunctional epoxies or in the presence of about a 20% excess of difunctional epoxies if a thermoset is desired.

Formulations containing approximately one-to-one equivalent levels with difunctional epoxies can result in tough thermoplastics.  Standard epoxy catalysts such as amines, imidizoles, Lewis acids work well to cure EC-861 with epoxy resins.

Refer to the EC-861 Technical Data Sheet for additional information or you may contact Customer Service at 858-348-1122.